The company UniTemp GmbH was founded in August 2000. The corporate of objective is the development, manufacturing, sales and marketing of equipment for microelectronics.
1. In the beginning the UTP series started the successful way of Rapid Thermal Annealing ovens. Meanwhile this kind of oven has been improved and the new RTP and VPO series are well established on a world wide operating market. The key features of these ovens are fast ramp up rates (up to 150 K/sec up to 1200 °C) and its working size (up to 300mm wafer size).
2. Beside these ovens UniTemp is a specialist for reflow solder systems (RSS series) with a wide variety of options and accessories.
3. Another corporate of objective was the development of a semi automatic wire bonding machine, model WB-100. This machine has been sold to more than 90 customers worldwide. The WB-200 is the follower.
RTP-100 or RTP-150 Rapid Thermal Vacuum Process Oven
Our RTP oven series is a single wafer process
development tool for up to 1200°C. Optionally up to
vacuum up to 10E-6 hPa. Up to 150 mm wafer size.
The oven is SIMATIC controlled and can be easily
used by a touch panel system. This system is like a
table top system.
VPO-1000-300 Vacuum Process oven
The UniTemp VPO-1000-300 Oven is a compact
solution for processing up to 300 mm wafer size and up
to 1000 °C (optionally up to 1200 °C). Excellent ramp
up and ramp down rates are guaranteed by double
crossed IR lamp fields and cooling by gas. A lift pin
version and a remote control system is also available
as well as the option for connecting a robotics system.
WB-200 Wire Bonder
The WB-200 is a perfect tool for laboratory use and
small series. It allows an easy tool change from wedge
to ball bonding. For wire from 17-50μ (gold or
aluminium). Key feature is the 3 motorized axis (X, Y
and Z). The Z-axis is mouse controlled. For the options
we offer different solutions depending on the
customers demand and application.
Phone: +49 8441 787663
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