Equipment for Manufacturing Electronics on ceramics and wafers. (e.g application for LTCC/HTCC/SOFC/DBC/MLCC/SIC); Puncher (Mechanical/Laser), Screen-printer, AOI, Stacker, Sintering Furnace, Termination System, Core Driller, Automatic Electrical Tester, Disc Cutter, Polymer Chemical.
Inline or Offline AOI systems available: STRATUS NANO inspection: X/Y resolutions 8μm - 0.2μm per pixel for sub micron defects on circuits Substrates up to 12 inch (300mm). STRATUS MICRO inspection: X/Y resolutions 20μm - 1μm per pixel for micron size defects on circuits,Substrates up to 24 inch (600mm). STRATUS 3D inspection: (Z) Lateral resolutions from 0.5μm, X/Y resolutions 20μm - 1μm per pixel for micron size defects on circuits Substrates up to 10 inch
The EKRA semi-/fully automated screen and stencil printer prepared for the Industry 4.0 is the cutting edge tool for printing of a large variety of flexible and rigid substrates for applications from small to high volume applications, R&D as well as prototyping purposes. Available Special Transport Systems (STS) with a horizontally retractable table allows for quick reconfiguration and manual loading and unloading of the machine.
Puncher KMS Punchers precision, versatility and prepared for Industry 4.0 connections with MES The choice of the design of the punching tool is depending on customers requirements. The KMS tool concept is open for every kind of combinations, such as: - Via Pin diameters down to 50 um - Large punching with single punching units up to 25mm - Punching speed up to 30 hits/sec - Large module tools with 100s of pins punching - Inline inspection - Inline cleaning, flipping,...
PASS Ltd./Stratus-Vision GmbH
Lochhamer Schlag 17
Phone: +49 89 829989-19
Fax: +49 89 829989-99
ASYS Group China (Shanghai) Co., Ltd
5C, East Hope Plaza, 1777 Century Avenue, Pudong Shanghai , China
200122 Pudong Shanghai
P. R. China
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